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Parker Chomerics Thermally Conductive Gap Filler Pads

Parker THERM-A-GAP™ Pads

FEATURES/BENEFITS

  • Ultra low deflection force
  • High thermal conductivity
  • High tack surface reduces contact resistance
  • Various thicknesses available, finished in standard sheets
  • Custom sized configurations and/or cut parts are available as individual parts or on sheets
  • “A” version offers high strength acrylic PSA for ease of installation

Typical Applications

  • Telecommunications equipment
  • Consumer electronics
  • Automotive electronics (ECUs)
  • LEDs, lighting
  • Power conversion
  • Power semiconductors
  • Desktop computers, laptops, servers
  • Handheld devices
  • Memory modules
  • Vibration dampening

Parker Chomerics Thermal Interface

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PDF Parker Chomerics Thermal Interface Materials Catalog


Performance Guide

Parker THERM-A-GAP™ PAD 30

Parker Chomerics THERM-A-GAP™ PAD 30 is a thermally conductive, electrically isolating gap filler pad with a thermal conductivity of 3.2 W/m‐K. Designed to provide effective heat transfer between electronic devices, heat sinks, or other cooling features, THERM‐A‐GAP PAD 30 offers the ideal combination of heat transfer, low outgassing, and low compressing forces. With a Shore 00 hardness measurement of 30, it is designed to maintain conformability in gaps that contain uneven mating surfaces, air gaps, or where rough surface texture is a concern. THERM‐A‐GAP PAD 30 was developed to be a universal solution across applications and industries requiring a moderate level of thermal performance in electronic device designs. It is a cost‐effective solution and optimized for flexibility of design with several material carrier options available and ease of customization to unique shapes and sizes.

Product Features

  • 3.2 W/m-K thermal conductivity
  • Very low compression force
  • Very good thermal conductivity
  • High tack surface reduces contact resistance
  • “A” version offers high strength acrylic PSA for permanent attachment
  • UL recognized V-0 flammability
  • RoHS compliant
  • Vibration dampening

Parker Therm-A-Gap Pad 30

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PDF Parker Chomerics THERM-A-GAP PAD 30 Datasheet

Parker THERM-A-GAP™ PAD 60

Parker Chomerics THERM-A-GAP™ PAD 60 is a high performance, thermally conductive gap filler pad with a thermal conductivity of 6.0 W/m-K. It provides excellent heat transfer and low compression forces while still maintaining conformability between mating surfaces. THERM-A-GAP PAD 60 offers the combination of both excellent thermal conductivity and conformability, along with very low outgassing to provide an effective thermal interface between heat sinks and electronic devices where uneven surfaces, air gaps and rough surface textures may exist.

Product Features

  • 6.0 W/m-K thermal conductivity
  • Low compression force
  • High thermal conductivity
  • “A” version offers high strength acrylic PSA for permanent attachment
  • UL recognized V-0 flammability
  • RoHS compliant

Parker Therm-A-Gap Pad 60

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PDF Parker Chomerics THERM-A-GAP PAD 60 Datasheet

Parker THERM-A-GAP™ PAD 80

Parker Chomerics THERM-A-GAP™ PAD 80 is a high performance, thermally conductive gap filler pad with a typical thermal conductivity of 8.3 W/m-K. It provides superior heat transfer across a range of thicknesses while maintaining low compression forces and conformability between mating surfaces.

THERM-A-GAP™ PAD 80 is designed to serve as an effective thermal interface between heat sinks and heat generating components on electronic devices where uneven surfaces, air gaps, and rough surfaces may exist. PAD 80 is available in standard thicknesses as low as 0.030” to 0.200” (0.76mm to 5.1mm) and can be provided in sheets or cut to custom part sizes. It is available on several material carriers including an aluminum foil carrier that is supplied with pressure sensitive adhesive (PSA) for added adhesive strength during the assembly process

Product Features

  • 8.3 W/m-K thermal conductivity
  • Very low compression force
  • Electrically isolating
  • UL 94 V-0 flammability rating
  • “A” version offers high strength acrylic PSA for permanent attachment
  • Passes NASA outgassing requirements

Parker Therm-A-Gap Pad 80

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PDF Parker Chomerics THERM-A-GAP PAD 80 Datasheet

Parker THERM-A-GAP™ PAD 80LO

Parker Chomerics THERM-A-GAP™ PAD 80LO is a high performance, low oil bleed, thermal gap filler pad with a typical thermal conductivity of 8.0 W/m-K. PAD 80LO was developed to be a high reliability and long-term solution for mission critical and high-performance electronics in nearly every market segment including advanced computing, defense electronics, telecommunications and infrastructure.

“LO” in the product name stands for “Low Oil”, indicating the very low silicone oil bleed and migration properties of this gap pad. PAD 80LO is meant to be used where the aesthetic or manufacturing issues of silicone oils can be a concern.

PAD 80LO has a hardness of 60 Shore 00 and exhibits excellent stress relaxation over time, with a nearly 90% reduction in compression force after just one hour. It is designed to impart minimal stress on components such as integrated circuits and provide physical protection such as vibration dampening while maintaining effective thermal contact where conformability in gaps or rough surface texture is a concern.

Product Features

  • High thermal performance: 8.0 W/m-K conductivity
  • Very low oil bleed and migration
  • Very low compression force post-relaxation
  • High tack surface reduces contact resistance
  • Electrically isolating
  • UL 94 V-0 flammability rating

Parker Therm-A-Gap Pad 80LO

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PDF Parker Chomerics THERM-A-GAP PAD 80LO Datasheet

Typical Properties † PAD 30 PAD 60 PAD 70TP PAD 80 PAD 80LO Test Method
Physical Color Blue Green Dark Gray Dark Gray Grey Visual
Binder Silicone Silicone Silicone Silicone -- --
Carrier Options
Supported (standard)
G = Woven Glass carrier - no PSA
A = Aluminum foil carrier - with acrylic PSA
F = Woven glass carrier - centered on thickness.
No pressure sensitive adhesive (PSA) option
Supported (custom):
PN = PEN film carrier
KT = Thermally enhanced polyimide carrier

Unsupported (no carrier):
579 and 580 only - no letter notation needed 		PAD30G
PAD30A
PAD30PN
PAD30KT
PAD30 		PAD60A
PAD60 		PAD70TPG
PAD70TPA
PAD70TPF
PAD70TP 		PAD80A
PAD80G
PAD80PN
PAD80 		-- --
Standard Thicknesses*, in (mm) 0.020 - 0.200
(0.51 - 5.08)		 0.040 - 0.200
(1.0 - 5.0)		 0.030 - 0.200
(0.76 - 5.08)		 0.040 - 0.200
(0.5 - 5.0)		 0.040 - 0.200
(1.00 - 5.00)		 ASTM D374
Specific Gravity 2.9 3.3 3.3 3.4 3.4 ASTM D792
Hardness, Shore 00 30 40 15 35 60 ASTM D2240
Percent Deflection @ various pressures
(0.120 in thick sample)
@ 5 psi (34 kPA)
@ 10 psi (69 kPa)
@ 25 psi (172 kPa)
@ 50 psi (345 kPA) 		 
% Deflected
17
26
38
49** 		 
% Deflected
8
13
24
37 		 
% Deflected
18
42
63 ††
73 		 
% Deflected
13
25
50**
64** 		 
% Deflected
20
36
56
66
 ASTM C165
MOD (0.120 in "G" Type, 0.50 in diam probe, 0.025 in/min rate) §
Operating Temperature Range, °F (°C) -67 to 392
(-55 to 200)		 -67 to 392
(-55 to 200)		 -67 to 392
(-55 to 200)		 -67 to 392
(-55 to 200)		 -67 to 392
(-55 to 200)		 Chomerics
Thermal Thermal Conductivity, W/m-K 3.2 6.0 7.0 8.3 8.0 ASTM D5470
Thermal Impedance, °C-in2/W (°C-cm2/W)
@ 10 psi, @ 0.04 in (1 mm) thick, “G” version only		 0.4
(2.6)		 .028
(1.8)		 0.27
(1.7)		 0.15
(0.15)		 -- ASTM D5470
Heat Capacity, J/g-K 1 1 0.72 1 1 ASTM E1269
Coefficient of Thermal Expansion, ppm/K 150 150 150 150 -- ASTM E831
Electrical Dielectric Strength, Vac/mil (kVac/mm) 150 (6) 125 (8) 200 (8) 125 (5) 200 (8) ASTM D149
Volume Resistivity, ohm-cm 1013 1013 1013 1014 1013 ASTM D257
Dielectric Constant @ 1,000 kHz 7.7 9.3 5.6 6.0 9.1 ASTM D150
Dissipation Factor @ 1,000 kHz 0.001 0.006 0.001 0.002 0.001 CHO-TM-TP13
Regulatory Flammability Rating V-0 (Tested by Chomerics) V-0 (Tested by Chomerics) V-0 (Tested by Chomerics) V-0 (Tested by Chomerics) V-0 UL 94
RoHS Compliant Yes Yes Yes Yes Yes Chomerics Certification
Outgassing, % TML (% CVCM) 0.13
(0.03)		 0.05
(0.01)		 0.10
(0.03)		 0.11
(0.09)		 0.0480
(0.0034)		 ASTM E595
Shelf Life, months from date of shipment 36 36 24 36 24 Chomerics
Shelf Life, months from date of shipment - “A” aluminum foil carrier version ONLY 18 18 18 18 -- Chomerics
Storage Conditions, °F (°C) @ 50% Relative Humidity 50 to 90
(10 to 32)		 50 to 90
(10 to 32)		 50 to 90
(10 to 32)		 50 to 90
(10 to 32)		 50 to 90
(10 to 32)		 Chomerics
† Typical properties: these are not to be construed as specifications.
† † The typical deflection of THERM-A-GAP PAD70TP is approximately 15-40%.
* Thickness tolerance, inches(mm) is ±10% of the nominal part thickness for parts 0.100” (2.5mm) thick or less; those parts greater than 0.100” (2.5mm) thick are held to ±0.010” (0.25mm). Custom thicknesses may be available upon request.
** The typical deflection range is approximately 5-40%.
*** Laminated polyester film provides low abrasion on one side as well as improved dielectric isolation.
§ THERM-A-GAP PAD 60: ASTM C165 MOD (0.50in dia. probe, 0.025 in/min rate)

Parker Chomerics Thermal Management

Thermal Gap Filler Gels
Phase Change Materials
Thermal Tapes
Potting & Underfill Materials
Dielectric Pads
Heat Spreaders
Thermal Greases

Thermal Gap Filler Gels

Gels are low-closure-force, electrically isolating, fully cured materials that are dispensed into place.

FEATURES / BENEFITS

  • Dispensable
  • Fully cured
  • Highly conformable at low pressures
  • Vertical orientation of cartridge during storage
  • Single dispensable TIM can eliminate multiple pad part sizes/numbers
  • Reworkable

Phase Change Materials

Thin pads that are placed between a heatsink and the IC chip that then change phase into a liquid at higher temperatures to achieve a thin bond line for better thermal performance. Poly solder hybrid (PSH) materials consist of both binder and fillers which both change phase.

FEATURES/BENEFITS

  • Low thermal impedance
  • Demonstrated reliability through thermal cycling and accelerated age testing
  • Can be pre-applied to heat sinks
  • Protective release liner prevents contamination of material prior to final component assembly
  • Tabs available for easy removal of release liner (T710, T725*, T557, T777, PC07DM)
  • T725 is only offered with a tab
  • Available in custom die-cut shapes, kiss-cut on rolls

Thermal Tapes

Adhesive on both sides to hold a heat sink in contact with an IC component.

FEATURES / BENEFITS

  • Offered in various forms to provide thermal, dielectric, and flame retardant properties
  • Offered in custom die-cut configurations to suit a variety of applications
  • Eliminates the need for mechanical attachment (i.e. screws, clips, rivets, fasteners)
  • Embossed version available
  • UL recognized V-0 flammability
  • No curing required, unlike epoxy or acrylic preforms or liquid systems
  • Easily reworkable

Potting and Underfill Materials

One- or two-component materials that are dispensed and then cured in place afterwards (unlike thermal gap filler gels, which are already cured when dispensed).

FEATURES / BENEFITS

  • Cures in place once dispensed
  • Dispensable form-in-place gap filling, potting, sealing and encapsulating
  • Excellent blend of high thermal conductivity, flexibility and ease of use
  • Conformable to irregular shapes without excessive force on components
  • Ready-to-use cartridge system eliminates weighing, mixing and de-gassing steps
  • Variety of kit sizes and configurations available to suit any application (handheld twin-barrel cartridges, Semco® tubes and pneumatic applicators)
  • Vibration damping

Dielectric Pads

Higher-closure-force pads specifically designed to be electrically isolating, also known as a dielectric, as well as being thermally conductive. Dielectric pads are typically used on power transistors that have an electrically energized base that will short out if made to directly contact a metal heat sink.

FEATURES / BENEFITS

  • Excellent mechanical strength and puncture resistance
  • Available with & without acrylic PSA
  • UL recognized V-0 flammability rating

Heat Spreaders

Utilize two different vehicles of thermal transfer: conduction to pull heat off an integrated circuit, and convection to use air flow over the product to remove that heat from the assembly.

FEATURES/BENEFITS

  • Component junction temperature reduction of 10 to 20°C is common
  • Easily added to existing designs to lower component temperatures and improve reliability
  • Custom shapes available for complex designs

Thermal Greases

Silicone-based pastes with a thermally conductive filler material meant to draw heat away from a heat generating component on a circuit board while filling very thin bond lines.

FEATURES/BENEFITS

  • Silicone based materials conduct heat between a hot component and a heat sink or enclosure
  • Fills interface variable tolerances in electronics assemblies and heat sink applications
  • Dispensable, highly conformable materials require no cure cycle, mixing or refrigeration
  • Thermally stable and require virtually no compressive force to deform under typical assembly pressures
  • Supports high power applications requiring material with minimum bond line thickness and high conductivity
  • Ideal for rework and field repair situations
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