Parker Chomerics Thermal Management

Thermal Interface Materials

What Are Thermal Interface Materials (TIMs)?

Thermal Interface Materials are substances used to fill the microscopic gaps and irregularities between heat-generating components (like processors or LEDs) and their heat sinks or other cooling solutions. The primary function of TIMs is to enhance the thermal conduction between these surfaces, improving the overall heat dissipation and maintaining optimal operating temperatures.

Why Are TIMs Important?

Efficient Heat Transfer:

Electronic devices generate heat during operation, and if this heat is not effectively managed, it can lead to performance degradation or even component failure. TIMs facilitate efficient heat transfer from the heat source to the heat sink or other cooling mechanisms, ensuring that the device remains within its safe operating temperature range.

Prevention of Overheating:

By improving the thermal conductivity between components, TIMs help prevent overheating, which can cause system instability, reduced lifespan of components, or permanent damage.

Enhanced Device Performance:

Proper thermal management can improve the performance of electronic devices by maintaining optimal operating temperatures, which is crucial for high-performance applications like gaming, computing, and telecommunications.

Applications of Thermal Interface Materials

Consumer Electronics:

TIMs are used in smartphones, tablets, laptops, and other devices to manage heat from processors and other high-power components.

Automotive Electronics:

They are crucial in managing heat in automotive control units, infotainment systems, and other electronic systems within vehicles.

Industrial Equipment:

TIMs help in managing heat in machinery, control panels, and other industrial devices.

Medical Devices:

They ensure optimal performance and reliability in medical equipment by managing heat effectively.


Parker Chomerics Thermal Management

Thermal Gap Filler Pads
Thermal Gap Filler Gels
Phase Change Materials
Thermal Tapes
Potting & Underfill Materials
Dielectric Pads
Heat Spreaders
Thermal Greases

THERM-A-GAP™ Pads- Thermally Conductive Gap Filler Pads

THERM-A-GAP™ gap-filler sheets and pads offer excellent thermal properties and conformability at low clamping forces.

FEATURES/BENEFITS

  • Ultra low deflection force
  • High thermal conductivity
  • High tack surface reduces contact resistance
  • Various thicknesses available, finished in standard sheets
  • Custom sized configurations and/or cut parts are available as individual parts or on sheets
  • “A” version offers high strength acrylic PSA for ease of installation

View Thermal Gap Filler Pads Details

Thermal Gap Filler Gels

Gels are low-closure-force, electrically isolating, fully cured materials that are dispensed into place.

FEATURES / BENEFITS

  • Dispensable
  • Fully cured
  • Highly conformable at low pressures
  • Vertical orientation of cartridge during storage
  • Single dispensable TIM can eliminate multiple pad part sizes/numbers
  • Reworkable

Phase Change Materials

Thin pads that are placed between a heatsink and the IC chip that then change phase into a liquid at higher temperatures to achieve a thin bond line for better thermal performance. Poly solder hybrid (PSH) materials consist of both binder and fillers which both change phase.

FEATURES/BENEFITS

  • Low thermal impedance
  • Demonstrated reliability through thermal cycling and accelerated age testing
  • Can be pre-applied to heat sinks
  • Protective release liner prevents contamination of material prior to final component assembly
  • Tabs available for easy removal of release liner (T710, T725*, T557, T777, PC07DM)
  • T725 is only offered with a tab
  • Available in custom die-cut shapes, kiss-cut on rolls

Thermal Tapes

Adhesive on both sides to hold a heat sink in contact with an IC component.

FEATURES / BENEFITS

  • Offered in various forms to provide thermal, dielectric, and flame retardant properties
  • Offered in custom die-cut configurations to suit a variety of applications
  • Eliminates the need for mechanical attachment (i.e. screws, clips, rivets, fasteners)
  • Embossed version available
  • UL recognized V-0 flammability
  • No curing required, unlike epoxy or acrylic preforms or liquid systems
  • Easily reworkable

Potting and Underfill Materials

One- or two-component materials that are dispensed and then cured in place afterwards (unlike thermal gap filler gels, which are already cured when dispensed).

FEATURES / BENEFITS

  • Cures in place once dispensed
  • Dispensable form-in-place gap filling, potting, sealing and encapsulating
  • Excellent blend of high thermal conductivity, flexibility and ease of use
  • Conformable to irregular shapes without excessive force on components
  • Ready-to-use cartridge system eliminates weighing, mixing and de-gassing steps
  • Variety of kit sizes and configurations available to suit any application (handheld twin-barrel cartridges, Semco® tubes and pneumatic applicators)
  • Vibration damping

Dielectric Pads

Higher-closure-force pads specifically designed to be electrically isolating, also known as a dielectric, as well as being thermally conductive. Dielectric pads are typically used on power transistors that have an electrically energized base that will short out if made to directly contact a metal heat sink.

FEATURES / BENEFITS

  • Excellent mechanical strength and puncture resistance
  • Available with & without acrylic PSA
  • UL recognized V-0 flammability rating

Heat Spreaders

Utilize two different vehicles of thermal transfer: conduction to pull heat off an integrated circuit, and convection to use air flow over the product to remove that heat from the assembly.

FEATURES/BENEFITS

  • Component junction temperature reduction of 10 to 20°C is common
  • Easily added to existing designs to lower component temperatures and improve reliability
  • Custom shapes available for complex designs

Thermal Greases

Silicone-based pastes with a thermally conductive filler material meant to draw heat away from a heat generating component on a circuit board while filling very thin bond lines.

FEATURES/BENEFITS

  • Silicone based materials conduct heat between a hot component and a heat sink or enclosure
  • Fills interface variable tolerances in electronics assemblies and heat sink applications
  • Dispensable, highly conformable materials require no cure cycle, mixing or refrigeration
  • Thermally stable and require virtually no compressive force to deform under typical assembly pressures
  • Supports high power applications requiring material with minimum bond line thickness and high conductivity
  • Ideal for rework and field repair situations